MicroFabSolutions provides expert services in the field of microtechnologies. 

We have access to a high quality microfabrication facility. It is composed of two clean rooms, microsystem integration and testing laboratories with a wide variety of capabilities at our disposal.

The microfabrication capabilities are:

• Metal Magnetron sputtering (Al, Al1%Si, Ti, TiN)
• Diffusion furnaces (dry and wet oxidation, boron and phosphourus diffusion, N2 annealing)
• LPCVD (TEOS, poly-Si, Silicon Nitride, BPSG)
• PECVD (Silicon oxide, Silicon Nitride, Amorphous Silicon)
• Projection lithography: CD 2um, accuracy 1um
• Stepping lithography: CD 350nm, accuracy 75nm
• Ion Implantation (B+, BF2 +, P+, As+, Ar+,B++, P++)
• PVD metallization (Gold, Chrome, Silver, Titanium, Platinum, Aluminum, Palladium..)
• Electroplating (gold, copper)
• Dry etching
• Wet etching

The measurement capabilities are:

• Field Effect SEM
• Ellipsometry
• Inspection μScopes
• Non contact profiling
• Contact profiling
• 4 point probe
• R. I. Measurement 

 The microsystem integration capabilities are:

• Wafer bonding (anodic, Au-Si eutectic, adhesive bonding)
• Screen Printer
• Wafer Dicing
• Assembly Station